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 Datasheet (Advance Information) TC2411 14-Bit, 1 GSPS Digital-to-Analog Converter with Standby Mode of Operation
The TC2411 is a 14-bit, 1 GSPS digital-to-analog converter that delivers exceptional high-frequency performance. The TC2411 is designed to support single or multiple transmit IF signals up to 500 MHz and to deliver superior dynamic range at a sampling rate up to a guaranteed 1 GSPS. A power down feature has been incorporated into the TC2411 which allows the part to be placed into a Standby Mode of operation. * * * High resolution High Clock rate Standby Mode for lower power dissipation
Applications
The TC2411's high sample rate makes it ideal for the following applications: * Signal generation * Direct digital synthesis (DDS) * Test and measurement * Software radio * Single- and multi-carrier transceivers * Radar (Including Burst mode capability)
Technical Features
* * * * * * * * * Signal-Noise Ratio.................74dBc @126MHz Signal Input...............1000MSPS, 14bits LVDS Spur Free Dynamic Range......75dBc @126MHz Clock Input Drive.. 0 to +13dBm, 25 differential Full Scale Output...........-2dBm, 50 differential Voltage Reference.........2.5V Bandgap On-Chip Power Dissipation .................................1.8W Technology ...................0.5 m SiGe BiCMOS Packaging......96 ball, Pb-free, Cavity-down BGA
Description
As shown in the functional block diagram below, the TC2411 features a 5-Bit Unary + 9-Bit Binary R2R architecture. 14-bit straight binary data can be input to the DAC at a sample rate of up to 1 GSPS. The DAC provides low-noise and low-spurious performance with digital IF input signals across the first Nyquist band. The highly linear analog output produced by the TC2411 may be filtered externally to reject the signal image, and is suitable for single-stage upconversion applications.
Ordering Information
PART NUMBER TC2411-IB TC2411-KIT TEMP RANGE (C) -40C to +85C +25C PACKAGE 96 ball Pb-free BGA CLOCK SPEED 1000 MHz
Evaluation Kit
5
Digital Input Clock In 2.5V Ref Out 2.5V Ref In
14
Buffer + Register
5 MSB Decode
31 Register
31 Unary
9
Analog Output
R-2R Ladder
Buf
9
Binary
Amp
Band Gap Amp Ref Cell
Figure 1: TC2411 Functional Block Diagram
1
Copyright 2004 TelASIC Communications, Inc. All rights reserved. www.telasic.com Tel: 310.955.3838. Specifications subject to change without notice.
Datasheet (Advance Information) TC2411
Absolute Maximum Ratings
(Electrical performance is not guaranteed at absolute maximum ratings. Exposure to absolute maximum ratings for an extended period of time may impair the useful life of the product) Parameter Max Unit Electrical +5.0V Supply Voltage AVCC, DVDD +5.5 V +3.3V Supply Voltage DVCC +3.6 V -5.0V Supply Voltage AVEE, DVEE -5.5 V Clock Input Voltage +4.0 Vpp Environmental Operating Temp Range Storage Temp Range Maximum Junction Temperature Reflow Soldering Peak Temperature
-40 to +85 -65 to +150 +110 +260
o o
C C o C o C
TC2411 Electrical Specifications
(AVEE, DVEE = -5V; AVCC, DVDD = +5V; DVCC = +3.3V; IOUT = 20 mA, -40oC to +85C ambient, unless otherwise noted)
DC SPECIFICATIONS CONDITION MIN TYP MAX UNITS
Supply Voltages AVCC, DVDD DVCC AVEE DVEE Normal Mode AVCC + DVDD + DVCC Current AVEE + DVEE Current Power Consumption Reference Voltage info Reference Output Load Regulation Resolution Standby Mode AVCC + DVDD + DVCC Current AVEE + DVEE Current Power Consumption 40 140 850 mA mA mW Vout_REF 0 < Isource < Imax 14 30 330 1.8 2.5 mA mA W V mV Bits 4.75 3.13 -5.25 -5.25 5.0 3.3 -5.0 -5.0 5.25 3.46 -4.75 -4.75 V V V V
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
TC2411 Electrical Specifications continued
DIGITAL SPECIFICATIONS
(AVEE, DVEE = -5V; AVCC, DVDD = +5V; DVCC = +3.3V; IOUT = 20 mA, -40oC to +85C ambient, unless otherwise noted)
CONDITION MIN TYP MAX UNITS
Logic Inputs (N1- N14, P1 - P14) Compatibility Input Impedance Common Mode Voltage (VCM) Differential Input High Level Differential Input Low Level Data Coding Switching characteristics Setup Time Hold Time Propagation Delay Time Data Rise Time Data Fall Time Reset (RST) High Level Low Level Pulse Width Pulse Repetition Rate Propagation Delay Standby Mode (SLP, SLN) Single Ended Drive Low Level High Level 0 3.3 1.0 1.4 Volts Volts Volts Volts 2.5 DC 3 200 3.3 0 Volts Volts ns MHz Clock cycles 10% to 90 % 90% to 10 % 130 440 400 220 230 ps ps ps ps ps VCM = +1.2V VCM = +1.2V Binary -100 LVDS 100 +1.2 +100 ohms V mV mV
Differential drive (External100)
Low Level High Level
ANALOG SPECIFICATIONS
CONDITION
MIN
TYP
MAX
UNITS
DAC Clock (CLKP, CLKN) Maximum Conversion Rate Differential Input Voltage Common-mode Input Voltage Differential Input Resistance Analog Output (VOP, VON) Full Scale Output Voltage Differential Output Resistance 20 mA Differential Output Current 0.480 50 Vp-p ohms Guaranteed 1000 1.5 -3.1 25 MSPS Vpp V ohms
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Datasheet (Advance Information) TC2411
DYNAMIC SPECIFICATIONS CONDITION MIN TYP MAX UNITS
DAC Output vs Frequency @ -0.5 dBFS fout = 33 MHz fout = 126 MHz fout = 251 MHz fout = 376 MHz fout = 490 MHz Noise Spectral Density @ -0.5 dBFS fout = 33 MHz fout = 126 MHz fout = 251 MHz fout = 376 MHz fout = 490 MHz SFDR vs Frequency @ -0.5 dBFS fout = 33 MHz fout = 126 MHz fout = 251 MHz fout = 376 MHz fout = 490 MHz IMD IF = 135 MHz, 145 MHz IF = 110 MHz, 120 MHz, 130 MHz, 140 MHz ACPR (EDGE) IF = 260 MHz IF = 230 MHz, 240 MHz, 260 MHz, 270 MHz ACPR (WCDMA) IF = 260 MHz IF = 230 MHz, 240 MHz, 260 MHz, 270 MHz Analog Output Response Output Settling Time Output Rise Time (10 - 90%) Output Fall Time (90 - 10%) Glitch Energy -FS to +FS transition +FS to -FS transition -MS to +MS transition +MS to -MS transition MS = Mid-Scale FS = Full-Scale 0.5 0.1 0.4 0.2 ps-V ps-V ps-V ps-V 220 230 pS pS pS 1 Tone @ -10.5 dBFS 4 Tones @ -17.5 dBFS -75 -76 dBc dBc 1 Tone @ -3.5 dBFS 4 Tones @ -15.5 dBFS -95 -88 dBc dBc 2 Tones @ -6.5 dBFS 4 Tones @ -12.5 dBFS -82 -82 dBc dBc -78 -75 -70 -65 -60 dBc dBc dBc dBc dBc -166 -164 -161 -161 -160 dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz -3 -3 -5 -8 -9 dBm dBm dBm dBm dBm
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Datasheet (Advance Information) TC2411
TC2411 Thermal Characteristics Normal Mode of Operation
Package 19X19 Cavity-down BGA 96L
JC (oC/W)
2.72
JA (oC/W)
0 m/s 20.2 2m/s 18.5 3m/s 17.5
Note Results based on FEA simulation without heat sink.
* * * * *
*
The DC power of the TC2411 is 1.8 W in normal mode of operation Maximum Junction Temperature is not to exceed 110oC. There is no need for an external heat sink if maximum ambient temperature is +70oC. An external heat sink is recommended for ambient temperatures in excess of +70oC to insure that the junction temperature does not exceed 110oC maximum. Use of standby mode reduces the average power dissipation proportional to the normal mode / standby mode duty cycle and allows a higher ambient temperature before a heat sink must be used to insure that the junction temperature does not exceed 110oC maximum. In the above table, JA is presented according to JEDEC JESD 51-2 (natural convection) and 51-6 (forced convection). Thermal simulation assumes the package is mounted on the test board specified by JEDEC JESD51-9 (101.6X114.3X1.6 mm, four layers).
Note: JC: Thermal resistance from junction to case. JA: Thermal resistance from junction to ambient.
Figure 2: Standby Mode Operational Truth Table
Control Signal STDBY_P STDBY_N Normal Mode L H Standby Mode H L
Figure 3: Standby/Normal Mode Timing
STDBY_P Standby Mode STDBY_N Normal Mode Standby Mode
<5S
<5S
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Datasheet (Advance Information) TC2411
Figure 4: TC2411 Typical Application Circuit
+5VD2 J3 Stdby R4 560 C5 1000pF R5 510
DGN D
R6 1K
C6 1000pF
SLN
SLP
2 AGN D 1 AGN D J3 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 14 pairs 4
G14 F14
CLKP CLKN
V re f _RA V o u t_Re f
RS T V bb
Clk In
3 6
M 14
L14
M1
A4
B2
B1
J1
T1
DGN D
T2 VOP D14 4 1 2 3 C14 6 J2 Analog O utput
N[1:14] Data P[1:14] D1 EXTCAP An o de C a th o d e
U1 TC2411
VON D V CC D V CC D V CC
AGN D
+5V D2
A3
D ig ita l I n p u t
B3
M2
C3 0.01uF
C4 1000pF
+5V A
K13
A8
AGN D
R8 110
R1 2.0K
TP33 R7 330 C7 1000pF
-5V A1
AGN D DGN D
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
Figure 4 (Cont): TC2411 Typical Application Circuit
B10 (GND_TRIM) B9 (GND_TRIM) B4 (VP1N7_TR)
A13 (AGND)
A14 (AGND)
D13 (AGND)
A10 (DGND)
G13 (AGND)
B13 (AGND)
B14 (AGND)
E13 (AGND)
E14 (AGND)
C13 (AGND)
F13 (AGND)
H13 (AVEE)
H14 (AVEE)
A12 (AVEE)
B11 (AGND)
A5 (DGND)
A6 (DGND)
A7 (DGND)
A9 (DGND)
G2 (AGND)
E2 (AGND)
F2 (AGND)
L13 (DVDD)
J14 (DVEE)
B12 (AVEE)
K14 (DVEE)
B7 (DVDD)
B8 (DVDD)
J13 (GND)
K2 (DVEE)
K1 (DVEE)
H2 (GND)
J2 (GND)
H1 (GND)
J1 (GND)
-5VD1 J4 9 8 7 Power 6 5 4 3 2 1 -5VPS +5VPS
-5VD
-5VDT
-5VA1
-5VA2
A11 (NC)
C2 (NC)
A1 (NC)
AGND
TP36
DGND
TP37
+5VD2
+5VA
1 3 VR1 6.2V 4
U2 BNX002 5 6
2
+5V FL3 +5VA C14 0.1uF
FL7 +5VD2 C9 0.01uF C18 0.1uF
C8 68uF
DGND PS_GND PS_GND PS_GND DGND C12 0.1uF C13 0.1uF AGND FL1 AGND -5VA2 FL5 C16 0.1uF FL4 -5VA1 FL8 -5VD1 C19 0.1uF
VR2 6.2V 3 1
4
5 U3 BNX002
6 2
C10 68uF
C11 0.01uF
AGND
AGND
DGND
-5V
FL2 -5VD C15 0.1uF
FL9 -5VDT C20 0.1uF
DGND
DGND
TC2411 Typical Application Circuit Parts List
FIND # 1 2 3 QTY 4 3 2 8 4 8 5 6 7 8 9 10 11 12 13 14 15 16 1 1 1 1 1 1 1 1 1 2 2 REFERENCE DESIGNATOR C4, C5, C6, C7 C3, C9, C11 C8, C10 C12, C13, C14, C15, C16, C18, C19, C20 Fl1, Fl2, Fl3, Fl4, Fl5, Fl7, Fl8, Fl9 R1 R4 R5 R6 R7 R8 T1 T2 U1 U2, U3 VR1, VR2 TYPE Capacitor Capacitor Capacitor Capacitor VALUE 1000pF 0.01uF 68uF 0.1uF BLM18A G221SN 2.0K 560 510 1K 330 110 TX-2-5-1 ADT11WT TC2411 BNX002 6.2V 5% 1% 1% 2% 2% 2% 2% 2% TOLERANCE 10% 10% 10% 10% MANUFACTURER / DESCRIPTION X7R X7R Tantalum X7R
Ferrite Bead Resistor Resistor Resistor Resistor Resistor Resistor Transformer Transformer DAC EMI Filter Zener
Murata
Mini-Circuits, 2:1 impedance ratio Mini-Circuits, 1:1 impedance ratio TelASIC, 14 Bit, 1GHz DAC Murata 1 Watt
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MKDSTC2411 Rev-
A2 (AVCC)
B5 (DVEE)
B6 (DVEE)
L2 (DVEE)
G1 (AVEE)
E1 (AVEE)
F1 (AVEE)
L1 (DVEE)
Datasheet (Advance Information) TC2411
TC2411 Performance Characteristics
Figure 5: SFDR vs. Frequency @ -0.5 dBFS*
SFDR vs. Frequency
0 -10 -20 -30 SFDR (dBc) -40 -50 -60 -70 -80 -90 0 50 100 150 200 250 Frequency (MHz) 300 350 400 450 500
Figure 6: Noise Floor vs. Frequency
Noise Floor vs. Frequency
-158 -159 -160 -161 -162 -163 -164 -165 -166 -167 0 50 100 150 200 250 Frequency (MHz) 300 350 400 450 500
* The values in Figure 1 include coax and filter losses in the setup. Figure 7: Clock Power Level vs. Noise
Noise Floor vs Clock Power -158 -159 Noise Floor (dBm/Hz) -160 -161 -162 -163 -164
-7 0
Figure 8: DAC Output Level vs. Frequency
Noise Floor (dBm/Hz
DAC Output Level vs Frequency
Fout = 49 MHz Fout = 149 MHz Fout = 249 MHz
DA Output (dB C m)
-1 -2 -3 -4 -5 -6
-165 -166 -6 -4 -2 0 2 4 6 8 10 Clock Power (dBm)
-8 -9 0 50 100 150 200 250 300 350 400 450 500 Frequency (MHz)
Figure 9: Two tone IMD (dBc) vs. Frequency
Intermodulation Distortion vs. Frequency
0 -10 Intermodulation Distortion (dBc) -20 -30 -40 -50 -60 -70 -80 -90 0 50 100 150 200 250 300 350 400 Frequency Center (MHz)
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
Figure 10: SFDR at 33 MHz
(-77 dBc)
Figure 11: SFDR at 126 MHz (-75 dBc)
Figure 12: SFDR at 251 MHz
(-72 dBc)
Figure 13: SFDR at 490 MHz (-61 dBc)
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
Figure 14: 2-Tone IMD
(-82 dBc)*
Figure 15: 4-Tone IMD (-82 dBc)*
Figure 16: ACPR 4-Tone WCDMA (-76 dBc)*
* listed values indicate the actual measured levels, whereas plots shown here are limited by the instrument dynamic range
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
Figure 17: TC2411 Timing Diagram
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
Figure 18: TC2411 Pinouts - 96 Ball Cavity-Down BGA Package (Ball Side UP)
14 A 13 12 AVEE 11 NC 10 9 8 7 DGND 6 5 4 VBB 3
ANODE
2
1
AGND AGND
DGND DGND DVCC DVDD
DGND DGND
AVCC AGND
VOUT_ REF
B
AGND AGND AVEE
AGND AGND AGND
DVDD DVEE
DVEE TR
VP1N7_ CATHODE VREF_ RA
C
VON
AGND
AGND DNC2
DNC1
D
VOP
AGND
EXTCAP
E
AGND AGND
AGND
AVEE
F
CLKN
AGND
AGND AVEE
G
CLKP
AGND
AGND AVEE
H
AVEE
AVEE
DGND DGND
J
DVEE
DGND
DGND DGND
K
DVEE DVCC
DVEE
DVEE
L
SLP
DVDD
DVEE
DVEE
M
SLN
DNC3
DVCC
RST
N
D0P
D1P
D2P
D3P
D4P
D5P
D6P
D7P
D8P
D9P
D10P
D11P
D12P
D13P
P
D0N
D1N
D2N
D3N
D4N
D5N
D6N
D7N
D8N
D9N
D10N
D11N
D12N
D13N
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
TC2411 I/O Descriptions
PIN
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 C1 C2 C13 C14 D1 D2 D13 D14 E1 E2 E13 E14 F1 F2 F13 F14 G1 G2 G13 G14
NAME
AGND AVCC ANODE VBB DGND DGND DGND DVCC DGND DGND NC AVNS AGND AGND VOUT_REF VREF_RA CATHODE VP1N7_TR DVEE DVEE DVDD DVDD AGND AGND AGND AVEE AGND AGND DNC1 AGND AGND VON EXTCAP DNC2 AGND VOP AVEE AGND AGND AGND AVEE AGND AGND CLKN AVEE AGND AGND CLKP
DESCRIPTION
ANALOG GND +5V REF AMP SUPPLY ANODE FOR TEMPERATURE DIODE +2.4V Bias DIGITAL GND DIGITAL GND DIGITAL GND +3.3V SUPPLY FOR ESD DIGITAL GND DIGITAL GND NO CONNECT -5V ANALOG SUPPLY ANALOG GND ANALOG GND VOLTAGE REFERENCE OUTPUT, +2.5V REFAMP INPUT CATHODE FOR TEMPERATURE DIODE -1.7V TEST POINT -5V SUPPLY -5V SUPPLY +5V DIGITAL SUPPLY +5V DIGITAL SUPPLY ANALOG GND ANALOG GND ANALOG GND -5V ANALOG SUPPLY ANALOG GND ANALOG GND DO NOT CONNECT ANALOG GND ANALOG GND DAC ANALOG OUPUT - COMPLEMENT REF AMP BYPASS CAPACITOR DO NOT CONNECT ANALOG GND DAC ANALOG OUPUT -5V ANALOG SUPPLY ANALOG GND ANALOG GND ANALOG GND -5V ANALOG SUPPLY ANALOG GND ANALOG GND DAC CLOCK INPUT - COMPLEMENT -5V ANALOG SUPPLY ANALOG GND ANALOG GND DAC CLOCK INPUT
PIN
N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 H1 H2 H13 H14 J1 J2 J13 J14 K1 K2 K13 K14 L1 L2 L13 L14 M1 M2 M13 M14
NAME
D13P D12P D11P D10P D9P D8P D7P D6P D5P D4P D3P D2P D1P D0P D13N D12N D11N D10N D9N D8N D7N D6N D5N D4N D3N D2N D1N D0N DGND DGND AVEE AVEE DGND DGND DGND DVEE DVEE DVEE DVCC DVEE DVEE DVEE DVDD SLP RST DVCC DNC3 SLN
DESCRIPTION
DATA INPUT BIT 13 (MSB) DATA INPUT BIT 12 DATA INPUT BIT 11 DATA INPUT BIT 10 DATA INPUT BIT 9 DATA INPUT BIT 8 DATA INPUT BIT 7 DATA INPUT BIT 6 DATA INPUT BIT 5 DATA INPUT BIT 4 DATA INPUT BIT 3 DATA INPUT BIT 2 DATA INPUT BIT 1 DATA INPUT BIT 0 (LSB) DATA INPUT BIT 13 - COMPLEMENT (MSB) DATA INPUT BIT 12 - COMPLEMENT DATA INPUT BIT 11 - COMPLEMENT DATA INPUT BIT 10 - COMPLEMENT DATA INPUT BIT 9 - COMPLEMENT DATA INPUT BIT 8 - COMPLEMENT DATA INPUT BIT 7 - COMPLEMENT DATA INPUT BIT 6 - COMPLEMENT DATA INPUT BIT 5 - COMPLEMENT DATA INPUT BIT 4 - COMPLEMENT DATA INPUT BIT 3 - COMPLEMENT DATA INPUT BIT 2 - COMPLEMENT DATA INPUT BIT 1 - COMPLEMENT DATA INPUT BIT 0 - COMPLEMENT (LSB) DIGITAL GND DIGITAL GND -5V ANALOG SUPPLY -5V ANALOG SUPPLY DIGITAL GND DIGITAL GND DIGITAL GND -5V DIGITAL SUPPLY -5V DIGITAL SUPPLY -5V DIGITAL SUPPLY +3.3V DIGITAL SUPPLY -5V DIGITAL SUPPLY -5V DIGITAL SUPPLY -5V DIGITAL SUPPLY +5V DIGITAL SUPPLY STANDBY INPUT RESET/BURST MODE +3.3V SUPPLY FOR ESD DO NOT CONNECT STANDBY INPUT - COMPLEMENT
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
Application Notes:
A. Power Supply Decoupling Add power supply decoupling nearby package pins as summarized below: 1. AVEE - bypass each group of pins with 0.1 uF capacitor to AGND. a. A12, B12 b. E1, F1, G1 c. H13, H14 2. DVEE - bypass each group of pins with 0.1 uF capacitor to DGND. a. K1, K2, L1, L2 b. J14, K14 c. B5, B6 3. DVDD - bypass each group of pins with 0.1 uF capacitor to DGND. a. B7, B8 b. L13 4. AVCC - bypass pin A2 with 0.1 uF capacitor to AGND. 5. DVCC - bypass pins A8, M2 and K13 with 1000 pF capacitor to DGND. B. Analog Outputs (VOP, VON) The TC2411 supplies differential analog DAC outputs at pins VOP and VON. Each pin is internally terminated with 25 ohms to analog ground, creating an effective 50 ohm differential source. When these outputs are connected to a single-ended, 50 ohm load through a 1:1 transformer, the resulting full-scale AC swing is approximately 500 mVpp (20 mA into 25 ohms). Each DAC output may be dc-coupled to a groundreferenced load. C. Clock Inputs (CLKP, CLKN) To achieve excellent phase noise performance, the TC2411 requires a differential clock input with low jitter characteristics. A 2:1 transformer may be used to convert a single-ended, 50 ohm clock source and provide a 25 ohm, ac-coupled, differential drive into CLKP and CLKN. These inputs are internally biased and terminated with 12.5 ohms per side. A very low-phase noise (low jitter) sinewave clock signal should be used for enhanced SNR performance. A sinewave oscillator featuring at least -130 dBc/Hz phase noise, above 20 KHz from the carrier is recommended. Best noise performance is achieved with clock sources capable of 1.5 Vpp or greater outputs. D. LVDS-Compliant Digital Inputs (D0P/N to D13P/N) The TC2411 offers an LVDS-compliant interface into the 14 bit data inputs. These inputs are differentially terminated on-chip with 100 ohms. 0000 corresponds to minus full-scale, while 3FFF represents plus fullscale. E. Reset/Burst Mode (RST) The TC2411 offers a burst mode capability whereby the DAC analog output can be asynchronously reset to the all zeros code (00 0000 0000 0000) irrespective of input data. Under normal operation, the RST pin should be held high at +3.3V. When a low signal (0V) is applied to RST, the DAC output resets to the all zeros code (minus full scale). Contact TelASIC sales for further information.
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
F. Temperature Diode (ANODE, CATHODE) The TC2411 provides an on-chip temperature diode which may be used to monitor die temperature. Applying +5V to the anode pin and measuring the cathode node voltage into a 2K ohm load, the user can convert the resulting voltage into a temperature. Contact TelASIC sales for further information. G. External Capacitor for Ref Amp (EXTCAP) The on-chip reference amplifier requires an external capacitor to maintain excellent phase noise and jitter characteristics. Attach two capacitors, 0.01 uF and 1000 pF, in parallel between the EXTCAP pin and -5V analog supply. H. Ref Amp Input (VREF_RA) VOUT_REF is an internally generated, +2.5V precision bandgap reference. Tie this output to VREF_RA, the ref amp input. I. Standby Mode Function (SLP, SLN) The TC2411 offers a Standby Mode capability whereby the power dissipation is reduced to 850mW. The standby function comes in on pins L14 (SLP) and M14 (SLN). Under normal operation both pins are left floating. This mode may be enabled with either a single-ended drive or a differential drive. Single-ended drive, M14 (SLN) pin should be left floating and L14 (SLP) pin should be held low at +0.0V for normal operation, L14 (SLP) pin should be held high at +3.3V (CMOS) for standby mode. Differential drive level requires external 100 ohm resistor between pins L14 (SLP) and M14 SLN) and uses standard LVDS, (i.e. low level is 1.0V, high level is 1.4V). For normal mode M14 (SLN) is set low and L14 (SLP) is set high. For sleep mode M14 (SLN) is set high and L14 (SLP) is set low. J. Do Not Connect Pins Pins DNC1 (C1), DNC2 (D2), and DNC3 (M13) should be left floating. Connecting these pins to ground or to either supply voltage will alter device performance and may damage the part.
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MKDSTC2411 Rev-
Datasheet (Advance Information) TC2411
Figure 19: TC2411
96 Ball, Cavity-Down BGA Package Outline Dimensions (mm)
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. TelASIC assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, TelASIC assumes no responsibility for the functioning of undescribed features or parameters. TelASIC reserves the right to make changes without further notice. TelASIC makes no warranty, representation or guarantee out of the application or use of any product or circuit, and specifically disclaims any and all liability, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the TelASIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use TelASIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold TelASIC harmless against all claims and damages.
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MKDSTC2411 Rev-


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